this is information on a product in full production. october 2013 docid022207 rev 2 1/7 HSP061-4F4 4-line esd protection for high speed lines datasheet - production data features ? flow-through routing to keep signal integrity ? ultralarge bandwidth: 13 ghz ? ultralow capacitance: 0.5 pf ? low leakage current: 70 na at 25 c ? extended operating junction temperature range: -40 c to 125 c ? small package size: 0.72 mm 2 ? very thin package: 0.380 mm typical ? rohs compliant complies with following standards ? iec 61000-4-2 level 4: ? 8 kv (contact discharge) ? 15 kv (air discharge) applications the HSP061-4F4 is designed to protect against electrostatic discharge on sub micron technology circuits driving: ? hdmi 1.3 and 1.4 ? digital video interface ? display port ? usb 3.0 ? serial ata description the HSP061-4F4 is a 4-channel esd array with a rail to rail architecture de signed specifically for the protection of high speed differential lines. the ultra-low variation of the capacitance ensures very low influence on signal-skew. the device is available in a flip-chip package with a 300 m pitch, which minimizes the pcb area. figure 1. pinout (bottom view) figure 2. functional schematic (top view) flip-chip package 6 bumps i/o i/o i/o i/o gnd gnd www.st.com
characteristics HSP061-4F4 2/7 docid022207 rev 2 1 characteristics table 1. absolute maximum ratings t amb = 25 c symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 contact discharge 8 kv iec 61000-4-2 air discharge 15 i pp repetitive peak pulse cu rrent (8/20 s) 3.5 a t j operating junction temperature range -40 to +125 c t stg storage temperature range -65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c table 2. electrical characteristics t amb = 25 c symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 6 v i rm leakage current v rm = 3 v 70 na v cl clamping voltage iec 61000-4-2, +8 kv contact (i pp = 30 a), measured at 30 ns 18 v c i/o - gnd capacitance (input/output to ground) v i/o = 0 v, f = 200 mhz to 3000 mhz, v osc = 30 mv 0.5 0.55 pf ? c i/o - gnd capacitance variation (input/output to ground) v i/o = 0 v, f = 200 mhz to 3000 mhz, v osc = 30 mv 0.03 0.05 pf f c cut-off frequency -3db 13 ghz z diff differential impedance t r = 200 ps (10 - 90%) (1) z 0 diff = 100 ? 85 100 115 ? 1. hdmi specification conditions. this information can be provided for other applic ations. please contact your local st office.
docid022207 rev 2 3/7 HSP061-4F4 characteristics 7 figure 3. leakage current versus junction temperature (typical values) figure 4. attenuation versus frequency 0.01 0.10 1.00 10.00 100.00 1000.00 25 50 75 100 125 i r (na) v r =v rm = 3 v tj (c) 100m 300m 1g 3g 10g -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 s21 db f (hz) figure 5. differential impedance (z diff ) (1) figure 6. eye diagram - hdmi mask at 3.35 gbps per channel (1) 1. hdmi specification conditions. this information can be provided for other applic ations. please contact your local st office. tr = 200 ps (10% - 90%) 12.5 /div z 0diff = 100 board + HSP061-4F4 figure 7. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 8. esd response to iec 61000-4-2 (-8 kv contact discharge) 50 v / div 20 ns / div 20 gs / s 50 v / div 20 ns / div 20 gs / s
package information HSP061-4F4 4/7 docid022207 rev 2 2 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. flip chip dimensions 300 m 40 ? 140 m 15 335 m 40 380 m 20 100 m 15 1200 m 50 300 m 40 600 m 50 figure 10. footprint recommendations (dimensions in mm) figure 11. marking 130 m recommended 130 m recommended 170 m maximum solder stencil opening: copper pad diameter: solder mask opening: 230 m minimum x y z w x w dot, xx = marking yww = datecode y = year, ww = week z = manufacturing location
docid022207 rev 2 5/7 HSP061-4F4 package information 7 figure 12. tape and reel specification dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 2.0 2.0 8.0 1.75 3.5 ? 1.55 0.46 0.67 0.2 1.27 x y w x w z x y w x w z x y w x w z x y w x w z x y w x w z x y w x w z x y w x w z
ordering information HSP061-4F4 6/7 docid022207 rev 2 3 ordering information figure 13. ordering information scheme 4 revision history table 3. ordering information order code marking package weight base qty delivery mode HSP061-4F4 ew flip chip 0.5 mg 1000 tape and reel (7?) hsp 06 1 - 4 f4 high speed line protection breakdown voltage version number of lines package f = flip chip 4 = pitch 300 m, bump height 150 m table 4. document revision history date revision changes 08-sep-2011 1 initial release. 31-oct-2013 2 added package thickness information in features and figure 9 .
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